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  1. Hycer Private Limited

    A customer oriented, technology based company providing advanced ceramic interconnect solutions for our worldwide customers Copyright © 2002 Hycer Private ...
    Wire bonding1
    Microcircuits1
    Hybrid IC1
    Hybrid assembly1
    Hybrid microcircuits1
    Hybrid packaging1
    Thick film microcircuits1
    Ceramic Screening1
    CSP - Chip scale packaging1
    Polymer printing1

    www.hycer.com - 2009-02-07

  2. Thick film microcircuits, Hybrid microcircuits, Hybrid Circuits, custom hybrid, Hybrid assembly, Hybrid packaging, print fired and trimmed (PFT) substrates, ...

    Thick film microcircuits,Hybrid microcircuits,Microcircuits, Hybrid IC, Ceramic Screening, CSP - Chip scale packaging, Polymer printing, Wire bonding, Hybrid ...
    hybrid2
    SMT2
    hybrids2
    HIC1
    Wire Bonding1
    SMT Assembly1
    Thick film1
    microcircuits1
    Hybrid IC1
    Hybrid Circuits1
    Laser Trimming1
    Hybrid assembly1
    Hybrid microcircuits1
    Hybrid packaging1
    multi-layer circuits1
    Thick film microcircuits1
    Ceramic Screening1
    CSP - Chip scale packaging1
    Polymer printing1
    ceramic circuit1
    ceramic circuits1
    Microcircuit assembly1
    Micro-circuits1
    Thick film assembly1
    Thick Film Circuit Assembly1
    thick film circuits0
    Thick Film HIC0

    www.hybrionic.com - 2009-02-07

  3. Sukratech Pte Ltd ::::::: Microelectronic Products

    Established in 1996, Sukra Tech Pte Ltd (formerly known as XPM Pte Ltd) is a service-oriented company for micro-electronic products manufacturing industries. ...
    tech3
    hybrid2
    SMT2
    hybrids2
    HIC1
    Wire bonding1
    SMT Assembly1
    Thick film1
    microcircuits1
    Hybrid IC1
    Hybrid Circuits1
    Laser Trimming1
    Hybrid assembly1
    Hybrid microcircuits1
    Hybrid packaging1
    multi-layer circuits1
    Thick film microcircuits1
    Ceramic Screening1
    CSP - Chip scale packaging1
    Polymer printing1
    ceramic circuit1
    ceramic circuits1
    Microcircuit assembly1
    Micro-circuits1
    sukra1
    Thick film assembly1
    Thick Film Circuit Assembly1
    sukratech0
    sukra tech0
    sukra tech pte ltd0

    www.sukratech.com - 2009-02-06

  4. Home

    optimizing materials and processes for semiconductor RF packaging, supplier management for technical products, reliability failures in semiconductor packaging,
    packaging3
    materials3
    semiconductor2
    DOE2
    SPC2
    process optimization1
    hybrid packaging1
    technical program management1
    low cost microwave0

    www.mckleroyassociates.com - 2009-02-13

polymer printing1 electronics4 hybrid microcircuits1 capacitors2 microcircuits1 design7

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